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芯片術(shù)語(yǔ)英語(yǔ)翻譯

芯片術(shù)語(yǔ)英語(yǔ)翻譯


A

Abrupt junction 突變結(jié)

Accelerated testing 加速實(shí)驗(yàn) 

Acceptor 受主 

Acceptor atom 受主原子 

Accumulation 積累、堆積 


Accumulating contact 積累接觸 

Accumulation region 積累區(qū) 

Accumulation layer 積累層 

Active region 有源區(qū) 

Active component 有源元 


Active device 有源器件 

Activation 激活 

Activation energy 激活能 

Active region 有源(放大)區(qū) 

Admittance 導(dǎo)納 


Allowed band 允帶 

Alloy-junction device

合金結(jié)器件 Aluminum(Aluminium) 鋁 

Aluminum – oxide 鋁氧化物 

Aluminum passivation 鋁鈍化 


Ambipolar 雙極的

Ambient temperature 環(huán)境溫度 

Amorphous 無(wú)定形的,非晶體的 

Amplifier 功放 擴(kuò)音器 放大器 

Analogue(Analog) comparator 模擬比較器 Angstrom 埃 


Anneal 退火 

Anisotropic 各向異性的 

Anode 陽(yáng)極 

Arsenic (AS) 砷 

Auger 俄歇 


Auger process 俄歇過(guò)程 

Avalanche 雪崩 

Avalanche breakdown 雪崩擊穿 

Avalanche excitation雪崩激發(fā) 

Icrank   芯片排行榜


B

Background carrier 本底載流子 

Background doping 本底摻雜 

Backward 反向 

Backward bias 反向偏置 

Ballasting resistor 整流電阻 


Ball bond 球形鍵合 


Band 能帶 


Band gap 能帶間隙 


Barrier 勢(shì)壘 


Barrier layer 勢(shì)壘層 


Barrier width 勢(shì)壘寬度 


Base 基極 


Base contact 基區(qū)接觸 


Base stretching 基區(qū)擴(kuò)展效應(yīng) 


Base transit time 基區(qū)渡越時(shí)間 


Base transport efficiency基區(qū)輸運(yùn)系數(shù) 


Base-width modulation基區(qū)寬度調(diào)制 


Basis vector 基矢 


Bias 偏置 


Bilateral switch 雙向開關(guān) 


Binary code 二進(jìn)制代碼


Binary compound semiconductor 二元化合物半導(dǎo)體 


Bipolar 雙極性的 


Bipolar Junction Transistor (BJT)雙極晶體管 


Bloch 布洛赫 


Blocking band 阻擋能帶 


Blocking contact 阻擋接觸 


Body - centered 體心立方 


Body-centred cubic structure 體立心結(jié)構(gòu) 


Boltzmann 波爾茲曼 


Bond 鍵、鍵合 


Bonding electron 價(jià)電子 


Bonding pad 鍵合點(diǎn) 


Bootstrap circuit 自舉電路 


Bootstrapped emitter follower 自舉射極跟隨器


Boron 硼 


Borosilicate glass 硼硅玻璃 


Boundary condition 邊界條件 


Bound electron 束縛電子 


Breadboard 模擬板、實(shí)驗(yàn)板 


Break down 擊穿 


Break over 轉(zhuǎn)折 


Brillouin 布里淵 


Brillouin zone 布里淵區(qū) 


Built-in 內(nèi)建的 


Build-in electric field 內(nèi)建電場(chǎng) 


Bulk 體/體內(nèi) Bulk absorption 體吸收 


Bulk generation 體產(chǎn)生 


Bulk recombination 體復(fù)合 


Burn - in 老化 


Burn out 燒毀 


Buried channel 埋溝 


Buried diffusion region 隱埋擴(kuò)散區(qū) 




C




Can 外殼 


Capacitance 電容 


Capture cross section 俘獲截面 


Capture carrier 俘獲載流子 


Carrier 載流子、載波


Carry bit 進(jìn)位位 


Carry-in bit 進(jìn)位輸入 


Carry-out bit 進(jìn)位輸出 


Cascade 級(jí)聯(lián) 


Case 管殼 


Cathode 陰極


Center 中心 


Ceramic 陶瓷(的) 


Channel 溝道 


Channel breakdown 溝道擊穿


Channel current 溝道電流 


Channel doping 溝道摻雜 


Channel shortening 溝道縮短 


Channel width 溝道寬度 


Characteristic impedance 特征阻抗 


Charge 電荷、充電 


Charge-compensation effects 電荷補(bǔ)償效應(yīng) 


Charge conservation 電荷守恒 


Charge neutrality condition 電中性條件 


Charge drive/exchange/sharing/transfer/storage 電荷驅(qū)動(dòng)/交換/共享/轉(zhuǎn)移/存儲(chǔ) 


Chemmical etching 化學(xué)腐蝕法 


Chemically-Polish 化學(xué)拋光 


Chemmically-Mechanically Polish (CMP) 化學(xué)機(jī)械拋光 Chip 芯片 


Chip yield 芯片成品率 


Clamped 箝位 


Clamping diode 箝位二極管 


Cleavage plane 解理面 


Clock rate 時(shí)鐘頻率 


Clock generator 時(shí)鐘發(fā)生器 


Clock flip-flop 時(shí)鐘觸發(fā)器 


Close-packed structure 密堆積結(jié)構(gòu) 


Close-loop gain 閉環(huán)增益


Collector 集電極 


Collision 碰撞 


Compensated OP-AMP 補(bǔ)償運(yùn)放 


Common-base/collector/emitter connection 共基極/集電極/發(fā)射極連接 


Common-gate/drain/source connection 共柵/漏/源連接 


Common-mode gain 共模增益 


Common-mode input 共模輸入 


Common-mode rejection ratio (CMRR) 共模抑制比 


Compatibility 兼容性 


Compensation 補(bǔ)償 


Compensated impurities 補(bǔ)償雜質(zhì) 


Compensated semiconductor 補(bǔ)償半導(dǎo)體 


Complementary Darlington circuit 互補(bǔ)達(dá)林頓電路 


Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) 


互補(bǔ)金屬氧化物半導(dǎo)體場(chǎng)效應(yīng)晶體管 


Complementary error function 余誤差函數(shù) 


Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 計(jì)算機(jī)輔助設(shè)計(jì)/ 測(cè)試 /制 


造 


Compound Semiconductor 化合物半導(dǎo)體 


Conductance 電導(dǎo) 


Conduction band (edge) 導(dǎo)帶(底) 


Conduction level/state 導(dǎo)帶態(tài) 


Conductor 導(dǎo)體


Conductivity 電導(dǎo)率 


Configuration 組態(tài)


Conlomb 庫(kù)侖 


Conpled Configuration Devices 結(jié)構(gòu)組態(tài) 


Constants 物理常數(shù) 


Constant energy surface 等能面 


Constant-source diffusion恒定源擴(kuò)散 


Contact 接觸 


Contamination 治污 


Continuity equation 連續(xù)性方程


Contact hole 接觸孔 


Contact potential 接觸電勢(shì) 


Continuity condition 連續(xù)性條件 


Contra doping 反摻雜 


Controlled 受控的 


Converter 轉(zhuǎn)換器 


Conveyer 傳輸器 


Copper interconnection system 銅互連系統(tǒng)


Couping 耦合 


Covalent 共階的 


Crossover 跨交 


Critical 臨界的 


Crossunder 穿交 


Crucible坩堝 


Crystal defect/face/orientation/lattice 晶體缺陷/晶面/晶向/晶 


格 


Current density 電流密度


Curvature 曲率 


Cut off 截止 


Current drift/dirve/sharing 電流漂移/驅(qū)動(dòng)/共享 


Current Sense 電流取樣 


Curvature 彎曲 


Custom integrated circuit 定制集成電路 


Cylindrical 柱面的 


Czochralshicrystal 直立單晶 


Czochralski technique 切克勞斯基技術(shù)(Cz法直拉晶體J) 


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D




Dangling bonds 懸掛鍵 


Dark current 暗電流 


Dead time 空載時(shí)間 


Debye length 德拜長(zhǎng)度 


De.broglie 德布洛意 


Decderate 減速 


Decibel (dB) 分貝 


Decode 譯碼 


Deep acceptor level 深受主能級(jí) 


Deep donor level 深施主能級(jí) 


Deep impurity level 深度雜質(zhì)能級(jí) 


Deep trap 深陷阱 


Defeat 缺陷 


Degenerate semiconductor 簡(jiǎn)并半導(dǎo)體 


Degeneracy 簡(jiǎn)并度 


Degradation 退化 


Degree Celsius(centigrade) /Kelvin 攝氏/開氏溫度 


Delay 延遲 Density 密度 


Density of states 態(tài)密度 


Depletion 耗盡 


Depletion approximation 耗盡近似 


Depletion contact 耗盡接觸 


Depletion depth 耗盡深度 


Depletion effect 耗盡效應(yīng) 


Depletion layer 耗盡層 


Depletion MOS 耗盡MOS 


Depletion region 耗盡區(qū) 


Deposited film 淀積薄膜 


Deposition process 淀積工藝 


Design rules 設(shè)計(jì)規(guī)則 


Die 芯片(復(fù)數(shù)dice) 


Diode 二極管 


Dielectric 介電的 


Dielectric isolation 介質(zhì)隔離 


Difference-mode input 差模輸入 


Differential amplifier 差分放大器 


Differential capacitance 微分電容 


Diffused junction 擴(kuò)散結(jié) 


Diffusion 擴(kuò)散 


Diffusion coefficient 擴(kuò)散系數(shù) 


Diffusion constant 擴(kuò)散常數(shù)


Diffusivity 擴(kuò)散率 


Diffusion capacitance/barrier/current/furnace 擴(kuò)散電容/勢(shì)壘/電流/爐 


Digital circuit 數(shù)字電路 


Dipole domain 偶極疇 


Dipole layer 偶極層 


Direct-coupling 直接耦合 


Direct-gap semiconductor 直接帶隙半導(dǎo)體 


Direct transition 直接躍遷 


Discharge 放電 


Discrete component 分立元件 


Dissipation 耗散 


Distribution 分布 


Distributed capacitance 分布電容 


Distributed model 分布模型 


Displacement 位移 Dislocation 位錯(cuò) 


Domain 疇 Donor 施主 


Donor exhaustion 施主耗盡 


Dopant 摻雜劑 


Doped semiconductor 摻雜半導(dǎo)體 


Doping concentration 摻雜濃度 


Double-diffusive MOS(DMOS)雙擴(kuò)散MOS. 


Drift 漂移 Drift field 漂移電場(chǎng) 


Drift mobility 遷移率 


Dry etching 干法腐蝕 


Dry/wet oxidation 干/濕法氧化


Dose 劑量 


Duty cycle 工作周期 


Dual-in-line package (DIP) 雙列直插式封裝 


Dynamics 動(dòng)態(tài) 


Dynamic characteristics 動(dòng)態(tài)屬性 


Dynamic impedance 動(dòng)態(tài)阻抗 




E




Early effect 厄利效應(yīng) 


Early failure 早期失效 


Effective mass 有效質(zhì)量 


Einstein relation(ship) 愛(ài)因斯坦關(guān)系 


Electric Erase Programmable Read Only Memory(E2PROM) 一次性電可擦除只讀存儲(chǔ)器 


Electrode 電極 


Electrominggratim 電遷移 


Electron affinity 電子親和勢(shì) 


Electronic -grade 電子能 


Electron-beam photo-resist exposure 光致抗蝕劑的電子束曝光 


Electron gas 電子氣 


Electron-grade water 電子級(jí)純水 


Electron trapping center 電子俘獲中心 


Electron Volt (eV) 電子伏 


Electrostatic 靜電的


Element 元素/元件/配件 


Elemental semiconductor 元素半導(dǎo)體


Ellipse 橢圓 


Ellipsoid 橢球 


Emitter 發(fā)射極 


Emitter-coupled logic 發(fā)射極耦合邏輯


Emitter-coupled pair 發(fā)射極耦合對(duì) 


Emitter follower 射隨器 


Empty band 空帶 


Emitter crowding effect 發(fā)射極集邊(擁擠)效應(yīng) 


Endurance test =life test 壽命測(cè)試 


Energy state 能態(tài) 


Energy momentum diagram 能量-動(dòng)量(E-K)圖 


Enhancement mode 增強(qiáng)型模式 


Enhancement MOS 增強(qiáng)性


MOS Entefic (低)共溶的 


Environmental test 環(huán)境測(cè)試 


Epitaxial 外延的 


Epitaxial layer 外延層 


Epitaxial slice 外延片 


Expitaxy 外延 


Equivalent curcuit 等效電路 


Equilibrium majority /minority carriers 平衡多數(shù)/少數(shù)載流子 


Erasable Programmable ROM (EPROM)可搽?。ň幊蹋┐鎯?chǔ)器 


Error function complement 余誤差函數(shù) 


Etch 刻蝕 


Etchant 刻蝕劑 


Etching mask 抗蝕劑掩模 


Excess carrier 過(guò)剩載流子 


Excitation energy 激發(fā)能 


Excited state 激發(fā)態(tài) 


Exciton 激子 


Extrapolation 外推法 


Extrinsic 非本征的 


Extrinsic semiconductor 雜質(zhì)半導(dǎo)體 


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F




Face - centered 面心立方 


Fall time 下降時(shí)間 


Fan-in 扇入 


Fan-out 扇出 


Fast recovery 快恢復(fù) 


Fast surface states 快界面態(tài) 


Feedback 反饋 


Fermi level 費(fèi)米能級(jí) 


Fermi-Dirac Distribution 費(fèi)米-狄拉克分布 


Femi potential 費(fèi)米勢(shì) 


Fick equation 菲克方程(擴(kuò)散) 


Field effect transistor 場(chǎng)效應(yīng)晶體管 


Field oxide 場(chǎng)氧化層 


Filled band 滿帶 


Film 薄膜 


Flash memory 閃爍存儲(chǔ)器 


Flat band 平帶 


Flat pack 扁平封裝 


Flicker noise 閃爍(變)噪聲 


Flip-flop toggle 觸發(fā)器翻轉(zhuǎn) 


Floating gate 浮柵 


Fluoride etch 氟化氫刻蝕 


Forbidden band 禁帶 


Forward bias 正向偏置 


Forward blocking /conducting正向阻斷/導(dǎo)通 


Frequency deviation noise頻率漂移噪聲 


Frequency response 頻率響應(yīng) 


Function 函數(shù) 




G




Gain 增益 Gallium-Arsenide(GaAs) 砷化鉀 


Gamy ray r 射線 


Gate 門、柵、控制極 


Gate oxide 柵氧化層 


Gauss(ian) 高斯 


Gaussian distribution profile 高斯摻雜分布


Generation-recombination 產(chǎn)生-復(fù)合 


Geometries 幾何尺寸 


Germanium(Ge) 鍺 


Graded 緩變的 


Graded (gradual) channel 緩變溝道 


Graded junction 緩變結(jié) 


Grain 晶粒 


Gradient 梯度 


Grown junction 生長(zhǎng)結(jié) 


Guard ring 保護(hù)環(huán) 


Gummel-Poom model 葛謀-潘 模型 


Gunn - effect 狄氏效應(yīng) 


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H




Hardened device 輻射加固器件 


Heat of formation 形成熱 


Heat sink 散熱器、熱沉 


Heavy/light hole band 重/輕 空穴帶 


Heavy saturation 重?fù)诫s 


Hell - effect 霍爾效應(yīng) 


Heterojunction 異質(zhì)結(jié) 


Heterojunction structure 異質(zhì)結(jié)結(jié)構(gòu) 


Heterojunction Bipolar Transistor(HBT)異質(zhì)結(jié)雙極型晶體 


High field property 高場(chǎng)特性 


High-performance MOS.( H-MOS)高性能


MOS. Hormalized 歸一化 


Horizontal epitaxial reactor 臥式外延反應(yīng)器 


Hot carrior 熱載流子 


Hybrid integration 混合集成 




I




Icrank   芯片排行榜


Image - force 鏡象力 


Impact ionization 碰撞電離 


Impedance 阻抗 


Imperfect structure 不完整結(jié)構(gòu) 


Implantation dose 注入劑量 


Implanted ion 注入離子 


Impurity 雜質(zhì)


Impurity scattering 雜志散射 


Incremental resistance 電阻增量(微分電阻)


In-contact mask 接觸式掩模 


Indium tin oxide (ITO) 銦錫氧化物 


Induced channel 感應(yīng)溝道 


Infrared 紅外的 


Injection 注入 


Input offset voltage 輸入失調(diào)電壓 


Insulator 絕緣體 


Insulated Gate FET(IGFET)絕緣柵


FET Integrated injection logic集成注入邏輯 


Integration 集成、積分 


Interconnection 互連 


Interconnection time delay 互連延時(shí) 


Interdigitated structure 交互式結(jié)構(gòu) 


Interface 界面 


Interference 干涉 


International system of unions國(guó)際單位制 


Internally scattering 谷間散射 


Interpolation 內(nèi)插法 


Intrinsic 本征的 


Intrinsic semiconductor 本征半導(dǎo)體 


Inverse operation 反向工作 


Inversion 反型 


Inverter 倒相器 


Ion 離子


Ion beam 離子束 


Ion etching 離子刻蝕 


Ion implantation 離子注入 


Ionization 電離 


Ionization energy 電離能 


Irradiation 輻照 


Isolation land 隔離島 


Isotropic 各向同性 


Icrank   芯片排行榜




J




Junction FET(JFET) 結(jié)型場(chǎng)效應(yīng)管 


Junction isolation 結(jié)隔離 


Junction spacing 結(jié)間距 


Junction side-wall 結(jié)側(cè)壁 




L




Latch up 閉鎖 


Lateral 橫向的 


Lattice 晶格 


Layout 版圖 


Lattice binding/cell/constant/defect/distortion 晶格結(jié)合力/晶胞/晶格/晶格常熟 


/晶格缺陷/晶格畸變 


Leakage current (泄)漏電流 


Level shifting 電平移動(dòng) 


Life time 壽命 


linearity 線性度 


Linked bond 共價(jià)鍵 


Liquid Nitrogen 液氮 


Liquid-phase epitaxial growth technique 液相外延生長(zhǎng)技術(shù) 


Lithography 光刻 


Light Emitting Diode(LED) 發(fā)光二極管 


Load line or Variable 負(fù)載線 


Locating and Wiring 布局布線 


Longitudinal 縱向的 


Logic swing 邏輯擺幅 


Lorentz 洛淪茲 


Lumped model 集總模型 




M




Majority carrier 多數(shù)載流子 


Mask 掩膜板,光刻板 


Mask level 掩模序號(hào) 


Mask set 掩模組 


Mass - action law質(zhì)量守恒定律


Master-slave D flip-flop主從D觸發(fā)器 


Matching 匹配 


Maxwell 麥克斯韋 


Mean free path 平均自由程 


Meandered emitter junction梳狀發(fā)射極結(jié) 


Mean time before failure (MTBF) 平均工作時(shí)間 


Megeto - resistance 磁阻 


Mesa 臺(tái)面 


MESFET-Metal Semiconductor金屬半導(dǎo)體FET 


Metallization 金屬化 


Microelectronic technique 微電子技術(shù) 


Microelectronics 微電子學(xué) 


Millen indices 密勒指數(shù) 


Minority carrier 少數(shù)載流子 


Misfit 失配 


Mismatching 失配 


Mobile ions 可動(dòng)離子 


Mobility 遷移率 


Module 模塊 


Modulate 調(diào)制 


Molecular crystal分子晶體 


Monolithic IC 單片IC MOSFET金屬氧化物半導(dǎo)體場(chǎng)效應(yīng)晶體管 


Mos. Transistor(MOST )MOS. 晶體管 


Multiplication 倍增 


Modulator 調(diào)制 


Multi-chip IC 多芯片IC 


Multi-chip module(MCM) 多芯片模塊 


Multiplication coefficient倍增因子 


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N




Naked chip 未封裝的芯片(裸片) 


Negative feedback 負(fù)反饋 


Negative resistance 負(fù)阻 


Nesting 套刻 


Negative-temperature-coefficient 負(fù)溫度系數(shù) 


Noise margin 噪聲容限 


Nonequilibrium 非平衡 


Nonrolatile 非揮發(fā)(易失)性 


Normally off/on 常閉/開 


Numerical analysis 數(shù)值分析 




O




Occupied band 滿帶 


Officienay 功率 


Offset 偏移、失調(diào) 


On standby 待命狀態(tài) 


Ohmic contact 歐姆接觸 


Open circuit 開路 


Operating point 工作點(diǎn) 


Operating bias 工作偏置 


Operational amplifier (OPAMP)運(yùn)算放大器 


Optical photon =photon 光子 


Optical quenching光猝滅 


Optical transition 光躍遷 


Optical-coupled isolator光耦合隔離器 


Organic semiconductor有機(jī)半導(dǎo)體 


Orientation 晶向、定向 


Outline 外形 


Out-of-contact mask非接觸式掩模 


Output characteristic 輸出特性 


Output voltage swing 輸出電壓擺幅 


Overcompensation 過(guò)補(bǔ)償 


Over-current protection 過(guò)流保護(hù) 


Over shoot 過(guò)沖 


Over-voltage protection 過(guò)壓保護(hù) 


Overlap 交迭 


Overload 過(guò)載 


Oscillator 振蕩器 


Oxide 氧化物 


Oxidation 氧化 


Oxide passivation 氧化層鈍化 


P




Package 封裝


Pad 壓焊點(diǎn) 


Parameter 參數(shù) 


Parasitic effect 寄生效應(yīng) 


Parasitic oscillation 寄生振蕩 


Passination 鈍化 


Passive component 無(wú)源元件 


Passive device 無(wú)源器件 


Passive surface 鈍化界面 


Parasitic transistor 寄生晶體管 


Peak-point voltage 峰點(diǎn)電壓 


Peak voltage 峰值電壓 


Permanent-storage circuit 永久存儲(chǔ)電路 


Period 周期 


Periodic table 周期表 


Permeable - base 可滲透基區(qū) 


Phase-lock loop 鎖相環(huán)


Phase drift 相移 


Phonon spectra 聲子譜 


Photo conduction 光電導(dǎo)


 Photo diode 光電二極管 


Photoelectric cell 光電池 


Photoelectric effect 光電效應(yīng) 


Photoenic devices 光子器件 


Photolithographic process 光刻工藝 


(photo) resist (光敏)抗腐蝕劑 


Pin 管腳 


Pinch off 夾斷 


Pinning of Fermi level 費(fèi)米能級(jí)的釘扎(效應(yīng)) 


Planar process 平面工藝 


Planar transistor 平面晶體管 


Plasma 等離子體 


Plezoelectric effect 壓電效應(yīng) 


Poisson equation 泊松方程 


Point contact 點(diǎn)接觸 


Polarity 極性 


Polycrystal 多晶 


Polymer semiconductor聚合物半導(dǎo)體 


Poly-silicon 多晶硅 


Potential (電)勢(shì) 


Potential barrier 勢(shì)壘 


Potential well 勢(shì)阱 


Power dissipation 功耗 


Power transistor 功率晶體管 


Preamplifier 前置放大器 


Primary flat 主平面 


Principal axes 主軸 


Print-circuit board(PCB) 印制電路板 


Probability 幾率 


Probe 探針 


Process 工藝 


Propagation delay 傳輸延時(shí) 


Pseudopotential method 膺勢(shì)發(fā) 


Punch through 穿通 


Pulse triggering/modulating 脈沖觸發(fā)/調(diào)制Pulse 


Widen Modulator(PWM) 脈沖寬度調(diào)制 


Punchthrough 穿通 


Push-pull stage 推挽級(jí) 


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Q




Quality factor 品質(zhì)因子 


Quantization 量子化 


Quantum 量子 


Quantum efficiency量子效應(yīng) 


Quantum mechanics 量子力學(xué) 


Quasi – Fermi-level準(zhǔn)費(fèi)米能級(jí) 


Quartz 石英 




R




Radiation conductivity 輻射電導(dǎo)率 


Radiation damage 輻射損傷 


Radiation flux density 輻射通量密度 


Radiation hardening 輻射加固 


Radiation protection 輻射保護(hù) 


Radiative - recombination輻照復(fù)合 


Radioactive 放射性 


Reach through 穿通 


Reactive sputtering source 反應(yīng)濺射源 


Read diode 里德二極管 


Recombination 復(fù)合 


Recovery diode 恢復(fù)二極管 


Reciprocal lattice 倒核子 


Recovery time 恢復(fù)時(shí)間 


Rectifier 整流器(管) 


Rectifying contact 整流接觸 


Reference 基準(zhǔn)點(diǎn) 基準(zhǔn) 參考點(diǎn) 


Refractive index 折射率 


Register 寄存器 


Registration 對(duì)準(zhǔn) 


Regulate 控制 調(diào)整 


Relaxation lifetime 馳豫時(shí)間 


Reliability 可靠性 


Resonance 諧振 


Resistance 電阻 


Resistor 電阻器 


Resistivity 電阻率 


Regulator 穩(wěn)壓管(器) 


Relaxation 馳豫 


Resonant frequency共射頻率 


Response time 響應(yīng)時(shí)間 


Reverse 反向的 


Reverse bias 反向偏置 




S

Sampling circuit 取樣電路 

Sapphire 藍(lán)寶石(Al2O3) 

Satellite valley 衛(wèi)星谷 

Saturated current range電流飽和區(qū) 

Saturation region 飽和區(qū)

Saturation 飽和的 

Scaled down 按比例縮小 


Scattering 散射 

Schockley diode 肖克萊二極管 

Schottky 肖特基 

Schottky barrier 肖特基勢(shì)壘 


Schottky contact 肖特基接觸 

Schrodingen 薛定厄 

Scribing grid 劃片格 

Secondary flat 次平面 

Seed crystal 籽晶 


Segregation 分凝 

Selectivity 選擇性 

Self aligned 自對(duì)準(zhǔn)的 

Self diffusion 自擴(kuò)散 

Semiconductor 半導(dǎo)體 


Semiconductor-controlled rectifier 可控硅 

Sendsitivity 靈敏度 

Serial 串行/串聯(lián) 

Series inductance 串聯(lián)電感 


Settle time 建立時(shí)間 

Sheet resistance 薄層電阻 

Shield 屏蔽

Short circuit 短路 

Shot noise 散粒噪聲


Shunt 分流 

Sidewall capacitance 

邊墻電容 Signal 信號(hào) 

Silica glass 石英玻璃 

Silicon 硅 


Silicon carbide 碳化硅 

Silicon dioxide (SiO2) 二氧化硅 

Silicon Nitride(Si3N4) 氮化硅 

Silicon On Insulator 絕緣硅 

Siliver whiskers 銀須 


Simple cubic 簡(jiǎn)立方 

Single crystal 單晶 

Sink 沉 

Skin effect 趨膚效應(yīng) 

Snap time 急變時(shí)間 


Sneak path 潛行通路 

Sulethreshold 亞閾的 

Solar battery/cell 太陽(yáng)能電池 

Solid circuit 固體電路 

Solid Solubility 固溶度 


Sonband 子帶 

Source 源極 

Source follower 源隨器 

Space charge 空間電荷 

Specific heat(PT) 熱 


Speed-power product 速度功耗乘積 Spherical 球面的 

Spin 自旋 Split 分裂 

Spontaneous emission 自發(fā)發(fā)射 

Spreading resistance擴(kuò)展電阻 

Sputter 濺射 Stacking fault 層錯(cuò) 


Static characteristic 靜態(tài)特性 

Stimulated emission 受激發(fā)射 

Stimulated recombination 受激復(fù)合 

Storage time 存儲(chǔ)時(shí)間 

Stress 應(yīng)力 


Straggle 偏差 

Sublimation 升華 

Substrate 襯底 

Substitutional 替位式的 

Superlattice 超晶格 


Supply 電源 Surface 表面 

Surge capacity 浪涌能力 

Subscript 下標(biāo) 

Switching time 開關(guān)時(shí)間 

Switch 開關(guān) 


T

Tailing 擴(kuò)展 

Terminal 終端 

Tensor 張量 Tensorial 張量的 

Thermal activation 熱激發(fā) 

Thermal conductivity 熱導(dǎo)率 

Thermal equilibrium 熱平衡 


Thermal Oxidation 熱氧化 

Thermal resistance 熱阻 

Thermal sink 熱沉 

Thermal velocity 熱運(yùn)動(dòng) 


Thermoelectricpovoer 溫差電動(dòng)勢(shì)率 

Thick-film technique 厚膜技術(shù) 

Thin-film hybrid IC薄膜混合集成電路 

Thin-Film Transistor(TFT) 薄膜晶體 

Threshlod 閾值 


Thyistor 晶閘管 

Transconductance 跨導(dǎo) 

Transfer characteristic 轉(zhuǎn)移特性 

Transfer electron 轉(zhuǎn)移電子 

Transfer function 傳輸函數(shù) Transient 瞬態(tài)的 


Transistor aging(stress) 晶體管老化 

Transit time 渡越時(shí)間 

Transition 躍遷 

Transition-metal silica 過(guò)度金屬硅化物 

Transition probability 躍遷幾率 


Transition region 過(guò)渡區(qū) 

Transport 輸運(yùn) Transverse 橫向的 

Trap 陷阱 Trapping 俘獲 

Trapped charge 陷阱電荷 

Triangle generator 三角波發(fā)生器 


Triboelectricity 摩擦電

Trigger 觸發(fā) 

Trim 調(diào)配 調(diào)整 

Triple diffusion 三重?cái)U(kuò)散 

Truth table 真值表 


Tolerahce 容差 

Tunnel(ing) 隧道(穿) 

Tunnel current 隧道電流 

Turn over 轉(zhuǎn)折 

Turn - off time 關(guān)斷時(shí)間 


U

Ultraviolet 紫外的 

Unijunction 單結(jié)的 

Unipolar 單極的 

Unit cell 原(元)胞 

Unity-gain frequency 單位增益頻率 

Unilateral-switch單向開關(guān) 


V

Vacancy 空位 Vacuum 真空 

Valence(value) band 價(jià)帶 Value band edge 價(jià)帶頂 

Valence bond 價(jià)鍵 Vapour phase 汽相 

Varactor 變?nèi)莨?Varistor 變阻器 

Vibration 振動(dòng) Voltage 電壓 


W

Wafer 晶片 

Wave equation 波動(dòng)方程 

Wave guide 波導(dǎo) 

Wave number 波數(shù) 


Wave-particle duality 波粒二相性 

Wear-out 燒毀 

Wire routing 布線 

Work function 功函數(shù) 

Worst-case device 最壞情況器件 


Y

Yield 成品率  


Z

Zener breakdown 齊納擊穿 

Zone melting 區(qū)熔法 


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