常用半導(dǎo)體中中文翻譯成英文
離子注入機(jī) ion implanter
LSS理論 Lindhand Scharff and Schiott theory,又稱“林漢德-斯卡夫-斯高特理論”。
溝道效應(yīng) channeling effect
射程分布 range distribution
深度分布 depth distribution
投影射程 projected range
阻止距離 stopping distance
阻止本領(lǐng) stopping power
標(biāo)準(zhǔn)阻止截面 standard stopping cross section
退火 annealing
激活能 activation energy
等溫退火 isothermal annealing
激光退火 laser annealing
應(yīng)力感生缺陷 stress-induced defect
擇優(yōu)取向 preferred orientation
制版工藝 mask-making technology
圖形畸變 pattern distortion
初縮 first minification
精縮 final minification
母版 master mask
鉻版 chromium plate
干版 dry plate
乳膠版 emulsion plate
透明版 see-through plate
高分辨率版 high resolution plate, HRP
超微粒干版 plate for ultra-microminiaturization
掩模 mask
掩模對(duì)準(zhǔn) mask alignment
對(duì)準(zhǔn)精度 alignment precision
光刻膠 photoresist,又稱“光致抗蝕劑”。
負(fù)性光刻膠 negative photoresist
正性光刻膠 positive photoresist
無(wú)機(jī)光刻膠 inorganic resist
多層光刻膠 multilevel resist
電子束光刻膠 electron beam resist
X射線光刻膠 X-ray resist
刷洗 scrubbing
甩膠 spinning
涂膠 photoresist coating
后烘 postbaking
光刻 photolithography
X射線光刻 X-ray lithography
電子束光刻 electron beam lithography
離子束光刻 ion beam lithography
深紫外光刻 deep-UV lithography
光刻機(jī) mask aligner
投影光刻機(jī) projection mask aligner
曝光 exposure
接觸式曝光法 contact exposure method
接近式曝光法 proximity exposure method
光學(xué)投影曝光法 optical projection exposure method
電子束曝光系統(tǒng) electron beam exposure system
分步重復(fù)系統(tǒng) step-and-repeat system
顯影 development
線寬 linewidth
去膠 stripping of photoresist
氧化去膠 removing of photoresist by oxidation
等離子[體]去膠 removing of photoresist by plasma
刻蝕 etching
干法刻蝕 dry etching
反應(yīng)離子刻蝕 reactive ion etching, RIE
各向同性刻蝕 isotropic etching
各向異性刻蝕 anisotropic etching
反應(yīng)濺射刻蝕 reactive sputter etching
離子銑 ion beam milling,又稱“離子磨削”。
等離子[體]刻蝕 plasma etching
鉆蝕 undercutting
剝離技術(shù) lift-off technology,又稱“浮脫工藝”。
終點(diǎn)監(jiān)測(cè) endpoint monitoring
金屬化 metallization
互連 interconnection
多層金屬化 multilevel metallization
電遷徙 electromigration
回流 reflow
磷硅玻璃 phosphorosilicate glass
硼磷硅玻璃 boron-phosphorosilicate glass
鈍化工藝 passivation technology
多層介質(zhì)鈍化 multilayer dielectric passivation
劃片 scribing
電子束切片 electron beam slicing
燒結(jié) sintering
印壓 indentation
熱壓焊 thermocompression bonding
熱超聲焊 thermosonic bonding
冷焊 cold welding
點(diǎn)焊 spot welding
球焊 ball bonding
楔焊 wedge bonding
內(nèi)引線焊接 inner lead bonding
外引線焊接 outer lead bonding
梁式引線 beam lead
裝架工藝 mounting technology
附著 adhesion
封裝 packaging
金屬封裝 metallic packaging
陶瓷封裝 ceramic packaging
扁平封裝 flat packaging
塑封 plastic package
玻璃封裝 glass packaging
微封裝 micropackaging,又稱“微組裝”。
管殼 package
管芯 die
引線鍵合 lead bonding
引線框式鍵合 lead frame bonding
帶式自動(dòng)鍵合 tape automated bonding, TAB
激光鍵合 laser bonding
超聲鍵合 ultrasonic bonding
紅外鍵合 infrared bonding
常用半導(dǎo)體中中文翻譯成英文
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